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Department of Mechanical Engineering

Prof. Ming-Yi Tsai

Ming-Yi Tsai

Professor
 
Research areas: Solid mechanics; Electronic/Optoelectronic packaging; Photomechanics; Adhesive bonding
Laboratory: Electronic Packaging Lab
Tel: +886-3-2118800 ext. 5743 (Office), 5809 (Lab)


Education:
- Ph. D., Engineering Science and Mechanics, Virginia Polytechnic Institute and State University (Virginia Tech), USA  (1990)
- M.S., Engineering Science and Mechanics, Virginia Polytechnic Institute and State University (Virginia Tech), USA
- B.S., National Cheng Kung University, Taiwan


Employments:
- Professor, Department of Mechanical Engineering, Chang Gung University, Taiwan, Aug. 2006
- Associate Professor, Department of Mechanical Engineering, Chang Gung University, Taiwan, Aug. 1997 ~ Jul. 2006
- Research Scientist, Tjing Ling Research Institute, National Taiwan University, Taiwan, Aug. 1996 ~ Jul. 1997
- Research Scientist, Department of Engineering Science and Mechanics, Virginia Tech, USA, Sept. 1993 ~ Aug. 1996
- Research Associate, Department of Engineering Science and Mechanics, Virginia Tech, USA, Jan. 1991 ~ Aug. 1993


Selected Publications:
  1. Tsai, M. Y., Oplinger, D. W. and Morton, J., " Improved Theoretical Solutions of Adhesive Joints, " Int. J. Solids and Structures, Vol. 35, No. 12, pp.1163-1185, 1998. (SCI/EI)
  2. Tsai, M. Y., Hsu, C. H. and Han, C. N., “A Note on Suhir’s Solution of Thermal Stresses a Die-Substrate Assembly, “Transaction of ASME, J. of Electronic Packaging, Vol. 126, pp.115-119, March 2004. (SCI/EI)).
  3. Tsai, M. Y., Hsu, C. H. and Wang, C. T., “Investigation of Thermomechanical Behaviors of Flip Chip BGA Packages During Manufacturing Process and Thermal Cycling,” IEEE Transactions on Components and Packaging Technologies Vol. 27, No. 3, pp.568-576, 2004. (SCI/EI)
  4. Tsai, M. Y., Lin, Y. C., Huang, C. Y and Wu, J. D., “Thermal Deformations and Stresses of Flip Chip BGA Packages with Low- and High-Tg Underfills,” IEEE Transactions on Electronics Packaging Manufacturing, Vol. 28, No. 4, pp.328-337, 2005. (SCI/EI))
  5. Tsai, M. Y., Wu, C. Y., Huang, C. Y., Cheng, W. C., and Yang, S. S., “Study of Some Parameters Effect on Warpage and Bump-Joint Stresses of COG Packages,” IEEE Transactions on Advanced Packaging, Vol. 29, No. 3 pp. 587-598, 2006. (SCI/EI))
  6. Tsai, M. Y., Wang, C. T. and Hsu, C. H., “The Effect of Epoxy Molding Compound on Thermal/Residual Deformations and Stresses in IC Packages During Manufacturing Process,” IEEE Transactions on Components and Packaging Technologies, Vol. 29, No. 3, pp. 625-635, Sept. 2006. (SCI/EI)
  7. Tsai, M. Y., Chen, C. H. and Lin, C. S., “Test Methods for Silicon Die Strength,” Transaction of ASME, J. of Electronic Packaging, Vol. 128, pp. 419-426, Dec. 2006. (SCI/EI)
  8. Tsai, M. Y. and Lin, C. S., “Testing and Evaluation of Silicon Die Strength,” IEEE Transactions on Electronics Packaging Manufacturing, Vol. 30, No. 2, pp. 106-114, April. 2007 (SCI/EI)
  9. Tsai, M. Y., Huang, C. Y., Chiang, C. Y., Chen, W. C., and Yang, S. S. “Experimental and Numerical Studies of Warpages of ACF-bonded COG Packages Induced from Manufacturing and Thermal Cycling,” IEEE Transactions on Advanced Packaging, Vol. 30, No. 4, pp. 665-673, Nov. 2007 (SCI/EI).
  10. Tsai, M. Y., Huang, C. Y., Chiang, C. Y., Chen, W. C., and Yang, S. S. “Hygro-Thermal Warpages of COG Package with Non-Conductive Paste Adhesive,” IEEE Transactions on Components and Packaging Technologies, Vol. 30, No. 3, pp. 517-525, Sept. 2007. (SCI/EI)
  11. Tsai, M. Y., Chen, Y. C., and Lee, S. W. Ricky, “Correlation between Measurement and Simulation of Thermal Warpage in PBGA with Consideration of Molding Compound Residual Strain,” IEEE Transactions on Components and Packaging Technologies, Vol. 31, No. 3, pp. 683-688, Sept. 2008 (SCI/EI).
  12. Tsai, M. Y., Wu, C. Y., Huang, C. Y., and Yang, S. S., “Transient Stress Distributions in NCF-Bonded COG Packages due to Moisture Diffusion,” IEEE Transactions on Advanced Packaging, Vol. 31, No. 3, pp. 454-462, Aug. 2008. (SCI/EI).
  13. Tsai, M. Y., Chang, H. Y. and Pecht, M. “Warpage Analysis of Flip-Chip PBGA Packages Subject to Thermal Loading,” IEEE Transactions on Device and Materials Reliability, Vol. 9, No. 3, pp.419-424, Sept. 2009(SCI/EI).
  14. Tsai, M. Y., Chiang, C. Y. C., Huang, Y. and Yang, S. S., “Residual Strain Measurement of Thin-Layer Cured Adhesives and Their Effects on Warpage in Electronic Packaging,” IEEE Transactions on Components and Packaging Technologies, Vol. 33, No. 1, pp.71-78, Mar. 2010 (SCI/EI).
  15. Tsai, M. Y. and Morton, J., “An Investigation into the Stresses in Double-Lap Adhesive Joints with Laminated Composite Adherends,” Int. J. Solids and Structures, No. 47, pp. 3317-3325, 2010. (SCI/EI).