研究領域:
●半導體構裝、光電構裝、膠著接合、複合材料力學、光學量測、有限元素分析
●在學術研究方面,早期以雷射光干涉原理與方法、用於研究複合材料及膠著接合之力學行為的領
域為主,近十幾年來跨入電子/光電構裝的研究,目前已略有成果,分別發表於國際著名學術期
刊。自出道迄今已發表百餘篇論文於不同國際會議及國外著名期刊,且曾擔任國內外知名學術期
刊的論文審核(如 IEEE Transactions on Advanced Packaging, IEEE Transactions on
Components and Packaging Technologies, IEEE Transactions on Electronics Packaging
Manufacturing, Microelectronics Reliability, Transaction of ASME, J. of Electronic
Packaging, International Journal of Solids and Structures, Journal of Composite
Materials, Experimental Mechanics, Journal of Adhesion, Journal of Mechanics, The
Chinese Journal of Mechanics等)。
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論文發表:
- M. Y. Tsai, Y. W. Wang and C. M. Liu, “Thermally-Induced Deformations and Warpages of Flip-Chip and 2.5D IC Packages Measured by Strain Gauges,” Materials, 14, 3723, pp.1-19, July 2021.
- M. Y. Tsai and Y. W. Wang, “A Theoretical Solution for Thermal Warpage of Flip-Chip Packages,” IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 10, No. 1 pp. 72-78, 2020
- M. Y. Tsai, J. H. Yeh, P. S. Huang, D. L. Chen, M. K. Shih, and David Tarng, “Geometric Nonlinear Effect on Biaxial Bending Strength of Thin Silicon Die in the PoEF Test,” IEEE Transactions on Device and Materials Reliability, vol. 20, No.2, pp.442-451, June 2020.
- M. Y. Tsai, P. S. Huang, J. H. Yeh, H. Y. Liu, Y. C. Chao, Fila Tsai, D. L. Chen, M. K. Shih, and David Tarng, “Evaluation of Three-Point Bending Strength of Thin Silicon Die with a Consideration of Geometric Nonlinearity,” IEEE Transactions on Device and Materials Reliability, vol. 19, No. 4, pp. 615-621, Dec. 2019
- M. Y. Tsai, H. J. Chen, and J. H. Yeh, “Evaluation of Bending Strength of Window Glass Substrate with Considerations of Uni- and Bi-axial Loading, and Free Edge Stresses,” ASME, Journal of Electronic Packaging, Vol. 141, pp. 041007-1~7, Dec. 2019
- M. Y. Tsai, G. M. Liu, Y. W. Wang, and H. Y. Liu, “Effects of Metal Frame and Adhesive on Thermally-Induced Warpage and Stress of 2.5D Packages: Experimental and Numerical Studies,” IEEE Transactions on Device and Materials Reliability, Vol.18, No.3, pp. 450-455, Sept. 2018.
- M. Y. Tsai, H. Y. Liu, G. M. Liu, H. L. Chen, and C. Y. Huang, “Strength Evaluation of Si Interposers by PoEF Test Associated with Acoustic Emission Method,” IEEE Transactions on Device and Materials Reliability, Vol. 7, No. 2, pp. 364-370, June 2017.
- M. Y. Tsai, C. H. Lin, K. F. Chuang, Y. H. Chang, C. T. Wu and S. C. Hu, “Failure and Stress Analysis of Through-Aluminum-Nitride-Via Substrates during Thermal Reliability Tests for High Power LED Applications,” Microelectronics Reliability, Vol. 67, pp. 120–128, Dec. 2016.
Ming-Yi Tsai - Google 學術搜尋引用文獻
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