聯絡資訊

• 電話：03-2118800 #5743
• 信箱：mytsai@mail.cgu.edu.tw
• 實驗室：電子構裝實驗室 #5809
• Ming-Yi Tsai Google 學術搜尋

學歷

• 美國維吉尼亞理工大學工程科學暨力學 博士
• 美國維吉尼亞理工大學工程科學暨力學 碩士
• 國立成功大學 學士

經歷

• 長庚大學 教授
• 長庚大學機械系 主任
• 長庚大學 副教授
• 台灣大學慶齡研究中心高分子複材研究群 研究員
• 美國維吉尼亞理工大學工程科學暨力學系 研究員
• 美國維吉尼亞理工大學工程科學暨力學系 博士後副研究員

研究領域

• 在學術研究方面，早期以雷射光干涉原理與方法、用於研究複合材料及膠著接合之力學行為的領域為主，近十幾年來跨入電子/光電構裝的研究，目前已略有成果，分別發表於國際著名學術期刊
• 自出道迄今已發表百餘篇論文於不同國際會議及國外著名期刊，且曾擔任國內外知名學術期刊的論文審核（如 IEEE Transactions on Advanced Packaging,  IEEE Transactions on Components and Packaging Technologies, IEEE Transactions on Electronics Packaging Manufacturing, Microelectronics Reliability, Transaction of ASME, J. of Electronic Packaging, International Journal of Solids and Structures, Journal of Composite Materials, Experimental Mechanics, Journal of Adhesion, Journal of Mechanics, The Chinese Journal of Mechanics等）

Highly Cited著作(Max:5篇Based on Google Scholar 2023/06)

• Tsai, M. Y., Oplinger, D. W. and Morton, J., "Improved Theoretical Solutions of Adhesive Joints, " Int. J. Solids and Structures, Vol. 35, No. 12, pp.1163-1185, 1998. (Citation=490)
• Tsai, M. Y. and Morton, J., "An Evaluation of Analytical and Numerical Solutions to the Single-lap Joint," Int. J. Solid and Structures Vol. 31, No. 18, pp.2537-2563, 1994. (Citation=278)
• Tsai, M. Y. and Morton, J., "The Effect of a Spew Fillet on Adhesive Stress Distributions in Laminated Composite Single-Lap Joints," Composite Structures, Vol. 32, pp.123-131, 1995. (Citation=263)
• Tsai, M. Y., Hsu, C. H. and Wang, C. T., “Investigation of Thermomechanical Behaviors of Flip Chip BGA Packages During Manufacturing Process and Thermal Cycling,” IEEE Transactions on Components and Packaging Technologies Vol. 27, No. 3, pp.568-576, 2004. (Citation=125)
• Tsai, M. Y., Hsu, C. H. and Han, C. N., “A Note on Suhir’s Solution of Thermal Stresses a Die-Substrate Assembly, “Transaction of ASME, J. of Electronic Packaging, Vol. 126, pp.115-119, March 2004. (Citation=101)

期刊論文(近五年)

• M. Y. Tsai and P. S. Huang, “Correction Factors to Strength of Thin Silicon Die in Three- and Four-Point Bending Tests Due to Nonlinear Effects,” Microelectronics Reliability, 128,114424, 2022, DOI: 10.1016/j.microrel.2021.114424.
• M. Y. Tsai and H. Y. Liu, “Geometric Nonlinear Effect on Biaxial Bending Strength of Thin Silicon Die in the Ball-on-Ring Test,” ASME, Journal of Electronic Packaging, Vol. 144, pp. 031002-1~11, Sept. 2022, DOI: 10.1115/1.4051256.
• M.C. Liao, P.S. Huang, T. C. Huang, and M.Y. Tsai “Backplate-Reinforced Structures for Enhancing Solder Joint Reliability of Server CPU Assembly Under Thermal Cycling,” J. of Mechanics, No. 37, pp. 693–703, 2021, DOI: 10.1093/jom/ufab035.
• M. Y. Tsai, Y. W. Wang and C. M. Liu, “Thermally-Induced Deformations and Warpages of Flip-Chip and 2.5D IC Packages Measured by Strain Gauges,” Materials, 14, 3723, pp.1-19, July 2021, DOI: 10.3390/ma14133723.
• M. Y. Tsai, J. H. Yeh, P. S. Huang, D. L. Chen, M. K. Shih, and David Tarng, “Geometric Nonlinear Effect on Biaxial Bending Strength of Thin Silicon Die in the PoEF Test,” IEEE Transactions on Device and Materials Reliability, vol. 20, No.2, pp.442-451, June 2020, DOI: 10.1109/TDMR.2020.2987010.
• M. Y. Tsai, P. S. Huang, J. H. Yeh, H. Y. Liu, Y. C. Chao, Fila Tsai, D. L. Chen, M. K. Shih, and David Tarng, “Evaluation of Three-Point Bending Strength of Thin Silicon Die with a Consideration of Geometric Nonlinearity,” IEEE Transactions on Device and Materials Reliability, vol. 19, No. 4, pp. 615-621, Dec. 2019, DOI: 10.1109/TDMR.2019.2937988.
• M. Y. Tsai, H. J. Chen, and J. H. Yeh, “Evaluation of Bending Strength of Window Glass Substrate with Considerations of Uni- and Bi-axial Loading, and Free Edge Stresses,” ASME, Journal of Electronic Packaging, Vol. 141, pp. 041007-1~7, Dec. 2019, DOI: 10.1115/1.4044961.
• M. Y. Tsai, G. M. Liu, Y. W. Wang, and H. Y. Liu, “Effects of Metal Frame and Adhesive on Thermally-Induced Warpage and Stress of 2.5D Packages: Experimental and Numerical Studies,” IEEE Transactions on Device and Materials Reliability, Vol.18, No.3, pp. 450-455, Sept. 2018, DOI: 10.1109/TDMR.2018.2865013.
• Meng-Chieh Liao, Pu-Shan Huang, Yi-Hsien Lin, Ming-Yi Tsai*, Chen-Yu Huang, and Te-Chin Huang, “Measurements of Thermally-Induced Curvatures and Warpages of Printed Circuit Board during a Solder Reflow Process Using Strain Gauges,” Applied Sciences-Basel, vol. 7, pp 739-750, July 2017, DOI: 10.3390/app7070739.
• M. Y. Tsai, H. Y. Liu, G. M. Liu, H. L. Chen, and C. Y. Huang, “Strength Evaluation of Si Interposers by PoEF Test Associated with Acoustic Emission Method,” IEEE Transactions on Device and Materials Reliability, Vol. 7, No. 2, pp. 364-370, June 2017, DOI: 10.1109/TDMR.2017.2683505.
• M. Y. Tsai, C. Y. Tang, C. E. Zheng, Y. Y. Tsai and C. H. Chen, “Thermal Analyses of LED Light Bars and Backlight Modules,” J. of Mechanics, Vol. 33, No. 3, pp.331-339, June 2017, DOI: 10.1017/jmech.2016.80.

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