蔡明義教授

最高學歷：美國維吉尼亞理工大學　工程科學暨力學博士
研究領域：電子/光電構裝、高分子複合材料、接合力學、實驗
力學、光學量測
聯絡方式：電話:(03)211-8800　分機　5743
　　　　　e-mail: mytsai@mail.cgu.edu.tw
實驗室：電子構裝實驗室分機 5809

簡歷：

             ●學歷:
         美國維吉尼亞理工大學工程科學暨力學博士
         美國維吉尼亞理工大學工程科學暨力學碩士
         國立成功大學   學士

●經歷:

長庚大學教授

長庚大學機械系主任

長庚大學副教授

台灣大學慶齡研究中心高分子複材研究群研究員

美國維吉尼亞理工大學工程科學暨力學系研究員

美國維吉尼亞理工大學工程科學暨力學系博士後副研究員

研究領域：

●半導體構裝、光電構裝、膠著接合、複合材料力學、光學量測、有限元素分析

     ●在學術研究方面，早期以雷射光干涉原理與方法、用於研究複合材料及膠著接合之力學行為的領
     域為主，近十幾年來跨入電子/光電構裝的研究，目前已略有成果，分別發表於國際著名學術期
       刊。自出道迄今已發表百餘篇論文於不同國際會議及國外著名期刊，且曾擔任國內外知名學術期
       刊的論文審核（如 IEEE Transactions on Advanced Packaging, IEEE Transactions on
       Components and Packaging Technologies, IEEE Transactions on Electronics Packaging
       Manufacturing, Microelectronics Reliability, Transaction of ASME, J. of Electronic
       Packaging, International Journal of Solids and Structures, Journal of Composite
       Materials, Experimental Mechanics, Journal of Adhesion, Journal of Mechanics, The
       Chinese Journal of Mechanics等）。

學會或專業認證：

IEEE member, IMAP member

論文發表：

M. Y. Tsai, Y. W. Wang and C. M. Liu, “Thermally-Induced Deformations and Warpages of Flip-Chip and 2.5D IC Packages Measured by Strain Gauges,” Materials, 14, 3723, pp.1-19, July 2021.
M. Y. Tsai and Y. W. Wang, “A Theoretical Solution for Thermal Warpage of Flip-Chip Packages,” IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 10, No. 1 pp. 72-78, 2020
M. Y. Tsai, J. H. Yeh, P. S. Huang, D. L. Chen, M. K. Shih, and David Tarng, “Geometric Nonlinear Effect on Biaxial Bending Strength of Thin Silicon Die in the PoEF Test,” IEEE Transactions on Device and Materials Reliability, vol. 20, No.2, pp.442-451, June 2020.
M. Y. Tsai, P. S. Huang, J. H. Yeh, H. Y. Liu, Y. C. Chao, Fila Tsai, D. L. Chen, M. K. Shih, and David Tarng, “Evaluation of Three-Point Bending Strength of Thin Silicon Die with a Consideration of Geometric Nonlinearity,” IEEE Transactions on Device and Materials Reliability, vol. 19, No. 4, pp. 615-621, Dec. 2019
M. Y. Tsai, H. J. Chen, and J. H. Yeh, “Evaluation of Bending Strength of Window Glass Substrate with Considerations of Uni- and Bi-axial Loading, and Free Edge Stresses,” ASME, Journal of Electronic Packaging, Vol. 141, pp. 041007-1~7, Dec. 2019
M. Y. Tsai, G. M. Liu, Y. W. Wang, and H. Y. Liu, “Effects of Metal Frame and Adhesive on Thermally-Induced Warpage and Stress of 2.5D Packages: Experimental and Numerical Studies,” IEEE Transactions on Device and Materials Reliability, Vol.18, No.3, pp. 450-455, Sept. 2018.
M. Y. Tsai, H. Y. Liu, G. M. Liu, H. L. Chen, and C. Y. Huang, “Strength Evaluation of Si Interposers by PoEF Test Associated with Acoustic Emission Method,” IEEE Transactions on Device and Materials Reliability, Vol. 7, No. 2, pp. 364-370, June 2017.
M. Y. Tsai, C. H. Lin, K. F. Chuang, Y. H. Chang, C. T. Wu and S. C. Hu, “Failure and Stress Analysis of Through-Aluminum-Nitride-Via Substrates during Thermal Reliability Tests for High Power LED Applications,” Microelectronics Reliability, Vol. 67, pp. 120–128, Dec. 2016.

Ming-Yi Tsai - Google 學術搜尋引用文獻

瀏覽數:

友善列印

蔡明義 教授

蔡明義教授