Prof. M. Y. Tsai of ME department of the CGU had a joint project entitled “Evaluation of PCB Reliability” in 2008,with Prof. M. Pecht (Director, IEEE and ASME Fellow), from CALCE in U. of Maryland, USA, and published the results together in
M. Y. Tsai, H. Y. Chang and M. Pecht, “Warpage Analysis of Flip-Chip PBGA Packages Subject to Thermal Loading,”IEEE Transactions on Device and Materials Reliability, Vol. 9, No. 3, pp.419-424, Sept. 2009
B. Sood, R. Sanapala, D. Das, M. Pecht, C. Y. Huang and M. Y. Tsai, “Comparison of Printed Circuit Board Property Variations in Response to Simulated Lead-free Soldering,” IEEE Transactions on Electronics Packaging Manufacturing, Vol. 33, No. 2, pp.98-110, April 2010
Prof. M. Y. Tsai of ME department of the CGU had a joint project entitled “Development of Warpage Measurement System,” during 2008~2009, with Prof. Ricky, Lee (Director, IEEE and ASME Fellow), from EPACK of Hong Kong University of Science and Technology, and has a joint-publication in
Tsai, M. Y., Chen, Y. C., and Lee, S. W. Ricky, “Correlation between Measurement and Simulation of Thermal Warpage in PBGA with Consideration of Molding Compound Residual Strain,” IEEE Transactions on Components and Packaging Technologies, Vol. 31, No. 3, pp. 683-688, Sept. 2008
