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Prof. Ming-Yi Tsai

Ming-Yi Tsai
Professor
 
Research areas: Solid mechanics; Electronic/Optoelectronic packaging; Photomechanics; Adhesive bonding
Laboratory: Electronic Packaging Lab
Tel: +886-3-2118800 ext. 5743 (Office), 5809 (Lab)

 
Education:
- Ph. D., Engineering Science and Mechanics, Virginia Polytechnic Institute and State University (Virginia Tech), USA  (1990)
- M.S., Engineering Science and Mechanics, Virginia Polytechnic Institute and State University (Virginia Tech), USA
- B.S., National Cheng Kung University, Taiwan
 
Employments:
- Professor, Department of Mechanical Engineering, Chang Gung University, Taiwan, Aug. 2006
- Associate Professor, Department of Mechanical Engineering, Chang Gung University, Taiwan, Aug. 1997 ~ Jul. 2006
- Research Scientist, Tjing Ling Research Institute, National Taiwan University, Taiwan, Aug. 1996 ~ Jul. 1997
- Research Scientist, Department of Engineering Science and Mechanics, Virginia Tech, USA, Sept. 1993 ~ Aug. 1996
- Research Associate, Department of Engineering Science and Mechanics, Virginia Tech, USA, Jan. 1991 ~ Aug. 1993

Selected Publications:
  1. M. Y. Tsai, Y. W. Wang and C. M. Liu, “Thermally-Induced Deformations and Warpages of Flip-Chip and 2.5D IC Packages Measured by Strain Gauges,” Materials, 14, 3723, pp.1-19, July 2021.
  2. M. Y. Tsai and Y. W. Wang, “A Theoretical Solution for Thermal Warpage of Flip-Chip Packages,” IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 10, No. 1 pp. 72-78, 2020
  3. M. Y. Tsai, J. H. Yeh, P. S. Huang, D. L. Chen, M. K. Shih, and David Tarng, “Geometric Nonlinear Effect on Biaxial Bending Strength of Thin Silicon Die in the PoEF Test,” IEEE Transactions on Device and Materials Reliability, vol. 20, No.2, pp.442-451, June 2020.
  4. M. Y. Tsai, P. S. Huang, J. H. Yeh, H. Y. Liu, Y. C. Chao, Fila Tsai, D. L. Chen, M. K. Shih, and David Tarng, “Evaluation of Three-Point Bending Strength of Thin Silicon Die with a Consideration of Geometric Nonlinearity,” IEEE Transactions on Device and Materials Reliability, vol. 19, No. 4, pp. 615-621, Dec. 2019
  5. M. Y. Tsai, H. J. Chen, and J. H. Yeh, “Evaluation of Bending Strength of Window Glass Substrate with Considerations of Uni- and Bi-axial Loading, and Free Edge Stresses,” ASME, Journal of Electronic Packaging, Vol. 141, pp. 041007-1~7, Dec. 2019
  6. M. Y. Tsai, G. M. Liu, Y. W. Wang, and H. Y. Liu, “Effects of Metal Frame and Adhesive on Thermally-Induced Warpage and Stress of 2.5D Packages: Experimental and Numerical Studies,” IEEE Transactions on Device and Materials Reliability, Vol.18, No.3, pp. 450-455, Sept. 2018.
  7. M. Y. Tsai, H. Y. Liu, G. M. Liu, H. L. Chen, and C. Y. Huang, “Strength Evaluation of Si Interposers by PoEF Test Associated with Acoustic Emission Method,” IEEE Transactions on Device and Materials Reliability, Vol. 7, No. 2, pp. 364-370, June 2017.
  8. M. Y. Tsai, C. H. Lin, K. F. Chuang, Y. H. Chang, C. T. Wu and S. C. Hu, “Failure and Stress Analysis of Through-Aluminum-Nitride-Via Substrates during Thermal Reliability Tests for High Power LED Applications,” Microelectronics Reliability, Vol. 67, pp. 120–128, Dec. 2016.