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Professor
Research areas: Solid mechanics; Electronic/Optoelectronic packaging; Photomechanics; Adhesive bonding
Laboratory: Electronic Packaging Lab
Tel: +886-3-2118800 ext. 5743 (Office), 5809 (Lab)
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Education:
- Ph. D., Engineering Science and Mechanics, Virginia Polytechnic Institute and State University (Virginia Tech), USA (1990)
- M.S., Engineering Science and Mechanics, Virginia Polytechnic Institute and State University (Virginia Tech), USA
- B.S., National Cheng Kung University, Taiwan
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| Employments:
- Professor, Department of Mechanical Engineering, Chang Gung University, Taiwan, Aug. 2006
- Associate Professor, Department of Mechanical Engineering, Chang Gung University, Taiwan, Aug. 1997 ~ Jul. 2006
- Research Scientist, Tjing Ling Research Institute, National Taiwan University, Taiwan, Aug. 1996 ~ Jul. 1997
- Research Scientist, Department of Engineering Science and Mechanics, Virginia Tech, USA, Sept. 1993 ~ Aug. 1996
- Research Associate, Department of Engineering Science and Mechanics, Virginia Tech, USA, Jan. 1991 ~ Aug. 1993
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Selected Publications:
- M. Y. Tsai, Y. W. Wang and C. M. Liu, “Thermally-Induced Deformations and Warpages of Flip-Chip and 2.5D IC Packages Measured by Strain Gauges,” Materials, 14, 3723, pp.1-19, July 2021.
- M. Y. Tsai and Y. W. Wang, “A Theoretical Solution for Thermal Warpage of Flip-Chip Packages,” IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 10, No. 1 pp. 72-78, 2020
- M. Y. Tsai, J. H. Yeh, P. S. Huang, D. L. Chen, M. K. Shih, and David Tarng, “Geometric Nonlinear Effect on Biaxial Bending Strength of Thin Silicon Die in the PoEF Test,” IEEE Transactions on Device and Materials Reliability, vol. 20, No.2, pp.442-451, June 2020.
- M. Y. Tsai, P. S. Huang, J. H. Yeh, H. Y. Liu, Y. C. Chao, Fila Tsai, D. L. Chen, M. K. Shih, and David Tarng, “Evaluation of Three-Point Bending Strength of Thin Silicon Die with a Consideration of Geometric Nonlinearity,” IEEE Transactions on Device and Materials Reliability, vol. 19, No. 4, pp. 615-621, Dec. 2019
- M. Y. Tsai, H. J. Chen, and J. H. Yeh, “Evaluation of Bending Strength of Window Glass Substrate with Considerations of Uni- and Bi-axial Loading, and Free Edge Stresses,” ASME, Journal of Electronic Packaging, Vol. 141, pp. 041007-1~7, Dec. 2019
- M. Y. Tsai, G. M. Liu, Y. W. Wang, and H. Y. Liu, “Effects of Metal Frame and Adhesive on Thermally-Induced Warpage and Stress of 2.5D Packages: Experimental and Numerical Studies,” IEEE Transactions on Device and Materials Reliability, Vol.18, No.3, pp. 450-455, Sept. 2018.
- M. Y. Tsai, H. Y. Liu, G. M. Liu, H. L. Chen, and C. Y. Huang, “Strength Evaluation of Si Interposers by PoEF Test Associated with Acoustic Emission Method,” IEEE Transactions on Device and Materials Reliability, Vol. 7, No. 2, pp. 364-370, June 2017.
- M. Y. Tsai, C. H. Lin, K. F. Chuang, Y. H. Chang, C. T. Wu and S. C. Hu, “Failure and Stress Analysis of Through-Aluminum-Nitride-Via Substrates during Thermal Reliability Tests for High Power LED Applications,” Microelectronics Reliability, Vol. 67, pp. 120–128, Dec. 2016.
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